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Frequently Asked Questions
 
     

 

 

Who are IQE Silicon Compounds?

What is epitaxy?

What is Strained Silicon?

What is IQE's UltraSmooth?

What are the specifications for IQE's UltraSmooth strained silicon?

What are the benefits of outsourcing?

Who are IQE's customers?

How can I find out more about how IQE can help me?

 

 

 

 

Q: Who are IQE Silicon Compounds?

A: IQE Silicon Compounds was formed in November 2000 and is a wholly owned subsidiary of IQE plc. The IQE Group has been an outsource supplier of advanced semiconductor materials since 1988 and has vast experience in III-V epitaxial structures. The Group decided to put its weath of expertise in the epitaxy field into the growing need for advanced materials for the mainstream silicon industry. Since its formation, IQE Silicon Compounds Ltd., based in the UK, has established a leading technological position for quality and service for a range of silicon based epitaxial technologies including SiGe, bulk Si, Strained Silicon and Raised Source/Drain materials.

 

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Q: What is epitaxy?

A: The word epitaxy is derived from the greek “epi” meaning surface and “taxi” meaning arrangement and refers to the process of growing complex structures atom-by-atom arranged onto the surface of a substrate.
 

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Q: What is Strained Silicon?

A:  Implementation of strained silicon into leading edge processes has been shown to give significant device performance enhancements.

Steady progress in the resolution capabilities of projection lithography tools has, up till now, allowed for economic scaling of gate lengths and other device structures in step with the International Technology Roadmap for Semiconductors.
 

However, things are set to change! Low power logic performance is now driven by the need for reduced leakage currents. Gate leakage and sub-threshold leakage are becoming major challenges and high-k gate dielectrics will be needed at the next technology nodes to address this. One of the problems with the new high-k materials is that they create a drag on the carriers in the channel, reducing effective mobilities. Therefore introduction of strained silicon is likely to happen ahead of high-k because without it high-k transistors will have no performance improvement over transistors with conventional gate oxides.
 

The substrate engineering required to produce a thin strained silicon film is complex and uses a SiGe based heteroepitaxy process to form a strain relaxed buffer layer with a larger lattice constant than silicon.
 

A thin, pseudomorphic layer of silicon is then grown directly on the buffer layer; this layer is tensile strained due to the larger lattice constant of the buffer layer on which it is grown.
 

Processes developed by IQE help remove the barriers to entry for strained silicon products. Wafer cost and poor surface quality have till now been two of the major issues preventing the adoption of strained silicon. Fundamental changes to the manufacturing process have now resulted in low cost, high quality strained silicon materials becoming available.

 

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Q: What is IQE's UltraSmooth strained silicon?

A: IQE's UltraSmooth strained silicon products are produced using a proprietary single stage epitaxial process. UltraSmooth strained silicon provides a highly cost effective entry route to strained silicon.
 

Advantages of UltraSmooth:

  • Single stage, continuous epi-process

  • Clean, simple, cost effective

  • Proprietary Technology

  • First to Market

  • Ge Content 10% - 30%

  • Low defectivity

  • UltraSmooth short range surface morphology

  • Available NOW

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Q: What are the specifications for IQE's UltraSmooth strained silicon?

A: Data sheets on IQE's strained silicon products can be found here.

 

Amongst the attributes that makes UltraSmooth "Best in Class" are:

  • Particle levels: <200 at 0.25um and <20 at 0.50um

  • Threading Dislocation Density (TDD): Mid 10E4

  • Pile-up Dislocation Density: <1cm/cm2

  • Surface Roughness: 10x10; Ra 5A and 1x1; Ra 0.5A

  • Germanium Uniformity: <3%

  • Strained Si Thickness Uniformity: <2%

  • Fully Relaxed Layer: >98%

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Q: What are the benefits of outsourcing?

A: Outsourcing saves money, resources and speeds products to market. The benefits of outsourcing are compelling. Outsourcing allows business to concentrate on their core competencies and reduce costs. Outsourcing helps companies decrease their debt by shifting capital to another company's books. The question shouldn't be, "Why outsource manufacturing?", but rather, "Why didn't we outsource manufacturing sooner?" Today, an improved bottom line is the driving force behind outsourcing; tomorrow, it will be pure survival.

In summary, the key benefits are:

  • Improved Return on Investment

  • Improved Profitability

  • Reduced Capital Spend

  • Ability to match epi-supply to demand

  • Faster Time to Market

  • Reduces or eliminates idle, In-house Capacity

  • Access to Advanced epi-Technologies

  • Ultimate Procurement Flexibility

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Q: Who are IQE's customers?

A: IQE's customers include a number of major, blue chip manufacturers worldwide comprising a mixture of integrated device manufacturers (IDMs), fabless and foundry operations. However, since preserving customer's IP is a primary feature of IQE's business relationships, confidentiality is of utmost importance and as such, we are unable to divulge customer names and details.
 

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Q: How can I find out more about how IQE can help me?

A: Our sales team are ready to help in whatever way they can. You can contact by email, phone, fax or mail. Click here to visit our contacts page.
 

 

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